Ceramic copper-clad substrates serve as circuit materials for semiconductors in power modules, connecting multiple power components and providing the electrical, thermal, chemical, and mechanical functions required to efficiently dissipate heat from semiconductors and extend the life of the module.
Compared with DBC ceramic substrates, AMB ceramic substrates have higher bonding strength and cold and thermal cycling characteristics. At present, with the rapid development of power electronics technology, high-power device control modules on high speed railways form a huge demand for ceramic copper clad laminates, the key material for IGBT module packaging, especially AMB substrates are gradually becoming mainstream applications.
WSP has prepared a silicon nitride ceramic copper-clad substrate using an active metal welding process, which is resistant to temperature cycling (-40~125℃) up to 5000 times and can carry a current greater than 300A, and has been used in electric vehicles, aerospace and other fields. The product uses an active metal welding process to bond multilayer oxygen-free copper to silicon nitride ceramics, while using copper pillar welding to achieve vertical interconnection, which is a good contribution to the requirements of miniaturization and high reliability of IGBT modules and SiC modules. In addition, progress has been made in applications such as high-power power semiconductor modules, high-frequency switches, wind power generation, new energy vehicles, power locomotives, and aerospace.
AMB substrates rely on the chemical reaction between ceramics and active metal solder paste at high temperature to achieve bonding, so they have higher bond strength and better reliability. However, due to the high cost of the method, the small number of suitable solders, and the influence of the solder on the reliability of the solder, only a few companies in the US, Japan, and China have mastered the core highly reliable reactive metal soldering technology.
More ceramic substrate process as well as the production of welcome to consult Nantong Wispel Semiconductor Co.
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