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      Upcoming Exhibitions | Wispell invites you to attend 2022 Power Device High Heat Dissipation Packaging Design New Material, Reliability Key Technology Seminar

      2022-07-28

      2022 Power Device High Heat Dissipation Packaging Design New Material,

      Reliability Key Technology Seminar

      圖片 | Wispell invites you to Suzhou

       圖片 Conference Introduction

      The theme of "2022 Power Device High Heat Dissipation Packaging Design New Material and Reliability Key Technology" will be "New Packaging - High Heat Dissipation - High Reliability", covering new packaging structure materials, sintered silver interconnection technology, packaging material reliability testing, thermal management, thermal and mechanical reliability simulation equipment. The seminar will cover new packaging structure materials, sintered silver interconnect technology, packaging material reliability test, packaging thermal management, thermal and mechanical reliability simulation equipment, aiming to help participants to understand the challenges of high-power power electronics packaging and to solve the thermal management and reliability problems of high-power power electronics from new materials, new equipment, new test methods and simulation technology.

      Nantong WSP is invited to be the sponsor of the conference and will bring samples of copper-clad ceramic substrates to the conference. WSP focuses on providing highly reliable heat dissipation base materials for IGBT/SIC power modules, and is fully committed to creating copper-clad ceramic substrate products based on AMB and DBC technologies; the company has obtained IATF 16949:2016 certification, and its products have met the supply requirements for automotive products, which will promote the low-carbon development of electric vehicles, rail transportation, smart grid, wind power generation, solar energy, white goods, aerospace and other industries. The company has obtained IATF 16949:2016 certification, and its products have met the requirements for supplying automotive products.

       圖片 Meeting time

          August 5, 2022

       圖片 Conference Venue   

          Wyndham Grand Hotel Suzhou, Jiangsu Province

       圖片 Exhibit Spoilers 

          The Si3N4 AMB and AlN AMB samples will be displayed at the WSP booth; the new product 120W Si3N4 AMB will also be on display, welcome to visit and discuss with our customers.


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      Tel: +86 513-81668686

      E-mail: [email protected]

      Website: www.winspowersemi.com
      Address: No.118 Shuangfu Road, High-tech Zone, Nantong City

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